04 — Manufacturing

The factory behind the brands — open to your OEM program

A 3,200 m² production base with SMT capability: ESL OEM, PCBA assembly, e-paper display modules, testing, QC, and export documentation for qualified B2B partners.

Capability Map

Manufacturing programs for qualified B2B partners

ESL OEM / ODM

Finished electronic shelf label programs, model planning, neutral datasheets, packaging support, and distributor-ready documentation.

PCBA assembly

Board-level assembly, firmware coordination, test fixtures, inspection workflow, and sourcing support for retail IoT hardware.

E-paper modules

E-paper display modules, wireless gateway accessory planning, enclosure coordination, and sample-to-pilot validation.

Quality control

Incoming material checks, SMT process notes, functional testing, burn-in expectations, packing checks, and export document control.

Manufacturing Workflow

From sample request to controlled pilot

Share product requirements, target market, enclosure needs, wireless requirements, firmware scope, order quantity, and certification expectations before sample planning.

01 Requirement review Product category, target market, enclosure, wireless, firmware, order quantity, and certification needs.

02 Engineering sample Display module, PCBA, firmware, test fixture, and pilot documentation alignment.

03 QC and export Incoming checks, functional testing, burn-in expectations, packing, and destination document review.

Talk to PanPanTech about your next program

Send your OEM, ODM, PCBA, or e-paper module requirements. We qualify the manufacturing path before quoting.

Request a Quote →