Capabilities
Capability map
The 3,200 m² base builds the group's own retail hardware and runs OEM programmes for qualified partners.
| Capability | Scope | Typical programmes |
|---|---|---|
| SMT | Surface-mount production for ESL boards, display driver boards and retail IoT hardware | ESL main boards, gateway boards |
| PCBA assembly | Board assembly with firmware coordination, test fixtures and inspection | Contract PCBA for retail IoT devices |
| E-paper modules | Display module lamination, validation and accessory coordination | Shelf-label and art-frame modules |
| Finished ESL | Model planning, enclosures, neutral datasheets and packaging | Private-label ESL programmes |
| QC and testing | Incoming checks, functional testing, burn-in expectations, packing inspection | All programmes |
| Export documentation | Destination-market document control and OEM packaging | Distributor and brand programmes |
Programme flow
Every OEM or PCBA programme follows the same stages. Sending complete information at the start shortens every one of them.
Product category, target market, enclosure, wireless, firmware scope, order quantity and certification needs.
Display module, PCBA, firmware and test fixture aligned and validated on samples.
A controlled pilot batch checks process, yield and packing before volume.
Incoming checks, functional testing, burn-in, packing inspection and destination document review.
Orders run against the agreed test plan and documentation set.
Quality checkpoints
Quality in electronics is decided at a few points in the process. These are the ones we document for every programme.
Panels, chips, batteries and enclosures are checked before they reach the line.
Process notes record settings for each board so repeat orders build the same way.
Fixtures test each board or label for display, wireless and power behaviour.
Burn-in expectations are agreed per product to catch early failures.
Labelling, quantity and packaging are checked against the order.
Export documents and datasheets are controlled per destination market.
RFQ checklist
Complete requirements let us qualify the manufacturing path before quoting, which is how we avoid surprises later in the programme.
Product type, display size, enclosure and any reference sample or drawing.
Schematics and BOM for PCBA work, or the functions you need for an ODM design.
Protocol, frequency band, and who owns and maintains the firmware.
Countries of sale, which decide certification and export documents.
Sample, pilot and annual volumes, and how orders will be split over the year.
Private label, neutral datasheets, packaging artwork and labelling rules.
FAQ
Yes, for qualified B2B partners. The base runs ESL OEM and ODM, PCBA assembly and e-paper module programmes alongside the group's own products.
Product category, target market, enclosure needs, wireless requirements, firmware scope, order quantity and certification expectations.
Firmware coordination is part of PCBA and ESL programmes; we agree scope, ownership and test coverage during requirement review.
It depends on the programme and on how much is custom. Our guide to ESL OEM and ODM explains how MOQ and lead time are set.
Our article on evaluating electronic shelf label manufacturers lists the SMT, RF, battery, lab and certification checks to make.
Yes. Neutral datasheets and OEM packaging are part of private-label programmes.